论文标题

使用半导体制造工艺进行大规模制造的改进基于BI-TE的柔性热电模块

Large-scalable fabrication of improved Bi-Te-based flexible thermoelectric modules using a semiconductor manufacturing process

论文作者

Okawa, Kenjiro, Amagai, Yasutaka, Fujiki, Hiroyuki, Kaneko, Nobu-Hisa, Tsuchimine, Nobuo, Kaneko, Hiroshi, Tasaki, Yuzo, Ohata, Keiichi, Okajima, Michio, Nambu, Shutaro

论文摘要

在存在的几个柔性热电模块中,基于BI-TE的模块代表了可行的选择,因为它们具有高输出功率密度和灵活性,从而实现了任意热源的使用。我们已经制造了基于BI-TE的模块,具有大量可观的制造工艺,并提高了其输出性能。使用柔性印刷电路的厚电极的相互连接电阻的降低将模块的输出功率显着提高到87 mW/cm $^{2} $,$ΔT$ = 70 K,比以前的原型模块高1.3倍。此外,通过使用表面安装技术来建立顶部电极的制造,使实现模块的高通量制造是可能的。我们的耐久性测试表明,在10000个机械弯曲测试和1000个热应力测试循环中,模块的内部电阻没有显着变化。

Among the several flexible thermoelectric modules in existence, sintered Bi-Te-based modules represent a viable option because of their high output power density and flexibility, which enables the use of arbitrary heat sources. We have fabricated Bi-Te-based modules with a large-scalable fabrication process and improved their output performance. The reduction in the interconnection resistance, using thick electrodes of the flexible printed circuit, significantly improves the module's output power to 87 mW/cm$^{2}$ at $ΔT$ = 70 K, which is 1.3-fold higher than a previous prototype module. Furthermore, the establishment of the fabrication for the top electrodes by using the surface mount technology makes it possible to realize a high-throughput manufacturing of the module. Our durability tests reveal that there is no significant change in the internal resistance of the module during 10000 cycles of mechanical bending test and 1000 cycles of thermal stress test.

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